Welcome

23rd International Forum on COCOMO® and Systems/Software Cost Modeling and ICM Workshop 3

Theme: Cost and Schedule Estimation for Next-Generation Processes

For 2008, the USC Center for Systems and Software Engineering will hold its annual Forum on COCOMO® and Systems/Software Cost Modeling on the USC campus in Los Angeles. Based on our successful 2006 Forum at the SSCI in the Washington DC area, we will hold the Forum in the DC area in 2009 and every third year thereafter. In 2008, we will focus the Forum theme on cost and schedule estimation for next generation processes, such as lean and agile methods, systems of systems, and integrated processes such as the Incremental Commitment Model (ICM). We will hold workshops October 29 – 30 on our draft ICM Guidebook, and on other related topics such as COSYSMO 2.0.

Related Forum topics include extending and integrating models for aspects such as schedule estimation, agile methods, COTS integration, value-based approaches, models for addressing software quality and security issues, and risk assessment. We would like to encourage submissions in these and other systems and software estimation related areas as well, including tool demonstration proposals.

Organization

General Chair: Barry Boehm, USC Program

Committee: Rick Selby (Northrop Grumman/USC, Chair), Barry Boehm (USC), Winsor Brown (USC), Sunita Chulani (IBM), Ed Colbert (USC), Jared Fortune (USC), LiGuo Huang (SMU/USC), Jo Ann Lane (USC), Dan Ligett (Softstar), Ray Madachy (USC), Ali Malik (USC), Chris Miller (OSD), Vu Nguyen (USC), Don Reifer (RCI/USC), Thomas Tan (USC), Ricardo Valerdi (MIT/USC), Ye Yang (ISCAS/USC)

Local Arrangements Chair: Julie Sanchez, USC (jasanche@usc.edu)

 

Key Dates: Forum and Workshops:
1-3 page Abstracts Due:
August 8, 2008 to rick.selby@ngc.com
Oct. 27 – 28: Forum (Contributed presentations, Tool Fair); Affiliates’ Dinner
Notification Date:
September 5, 2008
Oct. 29 – 30: Workshops (Incremental Commitment Model Guidebook III; COSYSMO 2.0; TBD)
Proceedings Materials Due:
October 10, 2008
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